PCB Heat Lamination Buffer Pad hmanga siam a ni

Sanpu Silicone Sponge Pad-a thil langsar tak chu:

1.High Temperature Resistance & Thermal Stability Properties:Powdering ni lo leh high{2}}temperature lamination tih nawn leh hnua hardening awm lo

2.Contamination hniam & Environment tichhe lo:RoHS leh FDA pass rawh

3.Closed-Cell Structure:Lamination process chhung hian board atanga tui vapor chhuak chu a absorb dawn lo va, a chhuak tha thei a, hei hian bubble, white spot leh delamination ang chi defect te a ti tlem thei a ni.

4.Chemical stability: Epoxy resin emaw PP prepreg resin emaw nen a inrem lo va, copper foil pawh a tichhe lo ang.

Silicone Sponge thatna PCB heat lamination buffer pad angin a tha hle

1. Copper thickness danglamna leh board unevenness compensate turin physical resilience tha tak a nei
2. Pressure insem dan inang tlang, delamination tlem zawk, void, copper indentation chhiatna
3. Temperature sang tak a do theihna leh thermal performance nghet tak a nei bawk
4. Moisture exhaust tha tak neih theih nan closed-cell structure
5. Sulfur hniam & volatile tlem, bawlhhlawh paih tlem, thianghlim siam chhuah
6. HDI tan hman nawn theih, tear-resistant, wide compatibility, copper rit tak, step PCB

Sanpu Silicone tih kha thlang rawh

1.Silicone sponge supplier original tak kan ni

2.Kum 16 chuang zet silicone sponge siamna lama tawnhriat kan nei a

3.Factory chhuahsan hmain enfiah ngei ngei tur,quality inspection report attached a ni

4.Free samples, free sample lak duh tan min rawn biak theih reng e